High resolution 3D X-ray microscopy and computed tomography are used to characterize the properties and behaviours of materials in a non-destructively manner.

By using a 3D X-ray microscope, it is possible to reveal details of microstructures in three dimensions (3D) and develop and confirm models or visualize structural details so the material in question can be thoroughly examined. 
In order to achieve the highest contrast and submicron resolution imaging even for relatively large samples we recommend a 3D X-ray microscope.
Our X-ray equipment covers a range of different options with respect to:
  • sample dimensions 
  • resolutions
  • energies – for optimising contrast and/or penetration through various material types
  • sample mounts, including environments for in situ investigations

The list below summarises the most prominent features of each of our available instruments.

ZEISS XRadia 410 Versa

zeiss xradia 410

Xradia Versa architecture uses a two-stage magnification technique to enable you to uniquely achieve resolution at a distance (RaaD). Enlarge sample images through geometric magnification as with conventional micro-CT. In the second stage, a scintillator converts X-rays to visible light, which is then optically magnified. Reducing dependence upon geometric magnification enables Xradia Versa instruments to maintain submicron resolution at large working distances. This enables us to study the widest range of sample sizes effectively, including within in situ chambers.

Nikon XT H 225

nikon x-ray

This instrument can penetrate larger and/or heavier specimens because of the higher energies available (up to 225 keV). The maximum field of view is 35 cm corresponding to a resolution of 200 µm, while the best achievable resolution is around 5 µm for mm-sized samples. Owing to the superior power (up to 225 W) the Nikon XT H 225 offers significantly faster imaging than the ZEISS Xradia 410 Versa for sample sizes between 5 mm and 5 cm at a comparable resolution.

Xradia nanoXCT-100

xradia nano

This instrument is equipped with an Excillum MetalJet source. It is currently being commissioned for 3D imaging with a resolution down to 50 nm in samples up to 65 µm. The Excillum MetalJet operates at the Ga K-edge of 9.2 keV, thus at a higher energy (for better penetration) and with a larger flux (for faster imaging) compared to the standard Xradia nanoXCT-100 source (7.8 keV Cu rotating anode).